5th Pan American Semicon FAB Design, Build & Facility Operations

The 5th Semiconductor FAB Design, Build & Facility Operations Summit, organized by Future Bridge, is an executive-level event scheduled for March 11–12, 2026, in Phoenix, Arizona. This premier forum focuses on the design, construction, and operation of next-generation semiconductor fabrication plants, addressing the unique challenges and opportunities driven by historic investments like the U.S. CHIPS Act. The summit brings together industry leaders, engineers, and technology providers from major companies such as Intel, AMD, Samsung, and TSMC to explore critical topics including cleanroom and contamination control, modular construction techniques, automation and robotics, and energy efficiency. Attendees can expect actionable insights through expert-led sessions, practical case studies, and extensive networking opportunities aimed at advancing American semiconductor manufacturing and infrastructure.